The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Sep. 28, 2022
Nd-hi Technologies Lab, Inc., Taipei City, TW;
Etron Technology, Inc., Hsinchu, TW;
Ho-Ming Tong, Taipei City, TW;
Chao-Chun Lu, Hsinchu, TW;
nD-HI Technologies Lab, Inc., Taipei City, TW;
ETRON TECHNOLOGY, INC., Hsinchu, TW;
Abstract
A die package includes a semiconductor die, a passive component, a molding compound and a redistribution layer (RDL). The semiconductor die includes a first bonding pad. The passive component includes a second bonding pad. The molding compound encloses the semiconductor die and the passive component. The RDL is disposed over the semiconductor die and the passive component and electrically connecting the first bonding pad with the second bonding pad. The semiconductor die is vertically overlapped with the passive component.