For the Inventor, By the Inventor

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Shanghai, China

Ase (Shanghai) Inc.

USPTO Granted Patents = 3

Forward Citations = 4

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11 inventors (with patents filed for the assignee):

Teck-Chong Lee (1 out of 40 patents)

Che-Ya Chou (1 out of 28 patents)

Shin-Hua Chao (1 out of 13 patents)

4. Chao-Fu Weng (1 out of 33 patents)

5. Ho-Ming Tong (1 out of 52 patents)

6. Yao-Ting Huang (1 out of 9 patents)

7. Chi-Chao Tseng (1 out of 2 patents)

8. Chian-Chi Lin (1 out of 14 patents)

9. Song-Fu Yang (1 out of 3 patents)

10. Kao-Ming Su (1 out of 4 patents)

11. Kuang-Lin Lo (1 out of 10 patents)

3 patents: Sort by Forward Citations

1. 7511366 - Multi-row substrate strip and method for manufacturing the same (2009-03-31),

2. 7504282 - Method of manufacturing the substrate for packaging integrated circuits without multiple photolithography/etching steps (2009-03-17),

3. 7445944 - Packaging substrate and manufacturing method thereof (2008-11-04),

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USPTO Data Jan 1 1976 - Jan 6 2026

3 Patents

#559 in Shanghai

#7,260 in China

Shanghai, China

Ase (Shanghai) Inc.

Forward Citations = 4

11 inventors:

Teck-Chong Lee (1 out of 40 patents)

Che-Ya Chou (1 out of 28 patents)

Shin-Hua Chao (1 out of 13 patents)

4. Chao-Fu Weng (1 out of 33 patents)

5. Ho-Ming Tong (1 out of 52 patents)

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