Chian-Chi Lin

This inventor holds 14 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Advanced Semiconductor Engineering, Inc., Ase (Shanghai) Inc.. Active years: 2006-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chian-Chi Lin. Retrieved from https://idiyas.com/inventor/chian-chi-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 14

% Patents Active = 78.6

Average Co-Inventor Count = 3.1

ph-index = 7

Forward Citations = 257(Granted Patents)

Location History:

Tainan, TW (2006 - 2009)
Kaohsiung, TW (2008 - 2012)

Company Filing History:

13 out of 1,971

Advanced Semiconductor Engineering, Inc.

Years Active: 2006-2012

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Areas of Expertise:

Three-Dimensional Package

Microelectromechanical

Chip Package Manufacturing

Wire-Bonding Method

Die-Bonding

Packaging Substrate

Wafer Level Bumping

Multi-Chip Module

Thermal Enhancement

14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8288853 - Three-dimensional package and method of making the same (2012-10-16),

2. 7945062 - Microelectromechanical microphone packaging system (2011-05-17),

3. 7790505 - Semiconductor chip package manufacturing method and structure thereof (2010-09-07),

4. 7741152 - Three-dimensional package and method of making the same (2010-06-22),

5. 7642132 - Three-dimensional package and method of making the same (2010-01-05),

6. 7581666 - Wire-bonding method for wire-bonding apparatus (2009-09-01),

7. 7547575 - Two-stage die-bonding method for simultaneous die-bonding of multiple dies (2009-06-16),

8. 7528053 - Three-dimensional package and method of making the same (2009-05-05),

9. 7446404 - Three-dimensional package and method of making the same (2008-11-04),

10. 7445944 - Packaging substrate and manufacturing method thereof (2008-11-04),

11. 7223683 - Wafer level bumping process (2007-05-29),

12. 7221041 - Multi-chips module package and manufacturing method thereof (2007-05-22),

13. 7045391 - Multi-chips bumpless assembly package and manufacturing method thereof (2006-05-16),

14. 7002805 - Thermal enhance MCM package and manufacturing method thereof (2006-02-21),

Title: The Innovative Journey of Chian-Chi Lin

Introduction: Chian-Chi Lin, a pioneering inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Chian-Chi Lin's most recent patents include advancements in renewable energy technology, smart home devices, and medical equipment, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: Throughout his illustrious career, Chian-Chi Lin has been recognized for his inventive prowess, receiving numerous awards for his groundbreaking technologies that have revolutionized various industries.

Collaborations: Chian-Chi Lin has collaborated with leading research institutions, universities, and tech companies worldwide to further develop and implement his innovative ideas, solidifying his reputation as a visionary inventor.

Conclusion: Chian-Chi Lin's relentless pursuit of innovation and his passion for creating cutting-edge solutions have established him as a trailblazing inventor whose impact will continue to shape the future of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]