The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Dec. 28, 2006
Ho-ming Tong, Taipei, TW;
Teck-chong Lee, Kaohsiung, TW;
Chao-fu Weng, Tainan, TW;
Chian-chi Lin, Tainan, TW;
Che-ya Chou, Kaohsiung, TW;
Shin-hua Chao, Kaohsiung, TW;
Song-fu Yang, Kaohsiung, TW;
Kao-ming Su, Kaohsiung, TW;
Ho-Ming Tong, Taipei, TW;
Teck-Chong Lee, Kaohsiung, TW;
Chao-Fu Weng, Tainan, TW;
Chian-Chi Lin, Tainan, TW;
Che-Ya Chou, Kaohsiung, TW;
Shin-Hua Chao, Kaohsiung, TW;
Song-Fu Yang, Kaohsiung, TW;
Kao-Ming Su, Kaohsiung, TW;
ASE (Shanghai) Inc., Shanghai, CN;
Abstract
A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.