Che-Ya Chou

This inventor holds 29 USPTO granted patents and 8 published patent applications and 7 EPO patents, primarily in Semiconductor Packaging. Top assignees: Mediatek Corporation, Advanced Semiconductor Engineering, Inc., Ase (Shanghai) Inc.. Active years: 2007-2026.

USPTO Granted Patents = 29 (Patent Applications = 8)

% Patents Active = 96.6

EPO Patents = 7 (Patent Applications = 20)

Average Co-Inventor Count = 3.4

ph-index = 4

Forward Citations = 163(Granted Patents)

Location History:

Hsin-Chu, TW (2019 - 2022)
Kaohsiung, TW (2007 - 2024)

Company Filing History:

Advanced Semiconductor Engineering, Inc.

Years Active: 2007-2026

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Areas of Expertise:

Flip-Chip Technology

Antenna Layer

Fan-Out Package

Conductive Shield

Wafer Level Package

Copper Column Interconnect

Redistribution Layer

Passive Device

Stacked Carrier Substrates

Package on Package

Packaging Substrate

Contact Sensor

29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12557215 - Semiconductor package using flip-chip technology (2026-02-17),

2. 11908759 - Semiconductor device (2024-02-20),

3. 11837552 - Semiconductor package with layer structures, antenna layer and electronic component (2023-12-05),

4. 11728292 - Semiconductor package assembly having a conductive electromagnetic shield layer (2023-08-15),

5. 11721882 - Semiconductor package having discrete antenna device (2023-08-08),

6. 11373957 - Semiconductor package with layer structures, antenna layer and electronic component (2022-06-28),

7. 11244913 - Semiconductor package (2022-02-08),

8. 10991669 - Semiconductor package using flip-chip technology (2021-04-27),

9. 10847869 - Semiconductor package having discrete antenna device (2020-11-24),

10. 10784206 - Semiconductor package (2020-09-22),

11. 10636773 - Semiconductor package structure and method for forming the same (2020-04-28),

12. 10515887 - Fan-out package structure having stacked carrier substrates and method for forming the same (2019-12-24),

13. 10497678 - Semiconductor package assembly with passive device (2019-12-03),

14. 10468341 - Semiconductor package assembly (2019-11-05),

15. 10224287 - Semiconductor device and wafer level package including such semiconductor device (2019-03-05),

Title: Inventor Che-Ya Chou: Revolutionizing Technology in Kaohsiung

Introduction: Che-Ya Chou is a visionary inventor based in Kaohsiung, Taiwan, known for his groundbreaking contributions to the field of technology.

Latest Patents: Che-Ya Chou holds several patents in the areas of artificial intelligence, renewable energy, and nanotechnology, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Che-Ya Chou has worked with leading tech companies, research institutions, and universities to develop cutting-edge solutions that have had a significant impact on various industries.

Collaborations: Throughout his career, Che-Ya Chou has collaborated with top scientists, engineers, and researchers from around the world, fostering a culture of innovation and knowledge exchange.

Conclusion: Che-Ya Chou's relentless pursuit of innovation and his passion for pushing the boundaries of technology make him a true pioneer in the field of inventions, inspiring the next generation of inventors to dream big and create a better future.