The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2019
Filed:
Dec. 26, 2018
Mediatek Inc., Hsin-Chu, TW;
Nai-Wei Liu, Kaohsiung, TW;
Tzu-Hung Lin, Zhubei, TW;
I-Hsuan Peng, Hsinchu, TW;
Che-Hung Kuo, Tainan, TW;
Che-Ya Chou, Kaohsiung, TW;
Wei-Che Huang, Zhudong Township, Hsinchu County, TW;
MEDIATEK INC., Hsin-Chu, TW;
Abstract
A semiconductor package assembly includes a redistribution layer (RDL) structure, which RDL structure includes a conductive trace. A redistribution layer (RDL) contact pad is electrically coupled to the conductive trace, and the RDL contact pad is composed of a symmetrical portion and an extended wing portion connected to the symmetrical portion. The RDL structure includes a first region for a semiconductor die to be disposed thereon and a second region surrounding the first region, and the extended wing portion of the RDL contact pad is offset from a center of the first region.