Che-Hung Kuo

Title: Che-Hung Kuo: Innovator in Semiconductor Technology

Introduction

Che-Hung Kuo is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 17 patents. His work focuses on innovative semiconductor package structures that enhance the performance and efficiency of electronic devices.

Latest Patents

Among his latest patents, Che-Hung Kuo has developed a semiconductor package structure that includes a substrate, a redistribution layer, a first semiconductor die, and a first capacitor. This structure is designed to improve the electrical coupling between components, ensuring better functionality. Another notable patent features a semiconductor package structure that incorporates a frontside redistribution layer, a first semiconductor die, a first capacitor, a conductive terminal, and a backside redistribution layer. These innovations reflect his commitment to advancing semiconductor technology.

Career Highlights

Che-Hung Kuo is currently employed at MediaTek Corporation, a leading company in the semiconductor industry. His work at MediaTek has allowed him to collaborate with other talented professionals and contribute to groundbreaking advancements in technology.

Collaborations

Some of his coworkers include Hsing-Chih Liu and Che-Ya Chou, who have also played vital roles in the development of innovative semiconductor solutions.

Conclusion

Che-Hung Kuo's contributions to semiconductor technology through his numerous patents highlight his expertise and dedication to innovation. His work continues to influence the industry and pave the way for future advancements.