The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Sep. 07, 2022
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Assignee:
MEDIATEK INC., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2023.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/3128 (2013.01); H01L 23/367 (2013.01); H01L 23/49811 (2013.01); H01L 23/5383 (2013.01); H01L 23/5389 (2013.01); H05K 1/145 (2013.01); H05K 1/181 (2013.01); H01L 24/16 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01);
Abstract
An electronic device includes a main printed circuit board (PCB) assembly comprising a bottom PCB and a semiconductor package mounted on an upper surface of the bottom PCB. The semiconductor package includes a substrate and a semiconductor die mounted on a top surface of the substrate. The semiconductor die and the top surface of the substrate are encapsulated by a molding compound. A top PCB is mounted on the semiconductor package through first connecting elements.