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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10847869 B1

PDFFull Text
Date of Patent:
Nov. 24, 2020

Filed:

May. 09, 2018

Semiconductor package having discrete antenna device

Applicant:

Mediatek Inc., Hsin-Chu, TW;

Inventors:

Fu-Yi Han, Taichung, TW;

Che-Ya Chou, Kaohsiung, TW;

Che-Hung Kuo, Tainan, TW;

Wen-Chou Wu, Hsinchu, TW;

Nan-Cheng Chen, Hsinchu, TW;

Min-Chen Lin, Hsinchu, TW;

Hsing-Chih Liu, Hsinchu, TW;

Assignee:

MediaTek Inc., Hsin-Chu, TW;

Attorney:

Wolf, Greenfield & Sacks, P.C.

Primary Examiner:

Andrea Lindgren Baltzell

Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/20 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16141 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19106 (2013.01);
Abstract

One embodiment of the present disclosure provides a semiconductor package including a bottom chip package having a first side and a second side opposing the first side, and a top antenna package mounted on the first side of the bottom chip package. The bottom chip package further includes a semiconductor chip. The semiconductor chip may include a RFIC chip. The top antenna package has at least one radiative antenna element.

Find Patent Forward Citations

Han, Fu-Yi. (2020). Semiconductor package having discrete antenna device (U.S. Patent No. 10847869). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10847869

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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