logo

For the Inventor, By the Inventor

Hsinchu, Taiwan

Hsing-Chih Liu

This inventor holds 23 USPTO granted patents and 3 published patent applications and 5 EPO patents, primarily in Semiconductor Packaging. Top assignee: Mediatek Corporation. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsing-Chih Liu. Retrieved from https://idiyas.com/inventor/hsing-chih-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.8

ph-index = 2

Forward Citations = 19(Granted Patents)


Location History:

  • Taichung, TW (2015 - 2024)
  • Hsinchu, TW (2020 - 2024)

Company Filing History:

goldMedal23 out of 5,115 
 
Mediatek Corporation
 patents

Years Active: 2015-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Package-on-Package
Semiconductor Package Structure
Thermal Interface
Discrete Antenna Device
Multi-Layer Redistribution
Bonding Pad Arrangement
Heat Spreading Structure
Noise Reduction
System-in-Package
Fabrication Method
23 patents (USPTO):Explore Patents
1. 12764974 - Semiconductor package having a thick logic die (2026-10-13),
2. 12648486 - Package-on-package having a thick logic die (2026-06-02),
3. 12300679 - Semiconductor package structure (2025-05-13),
4. 12230560 - Semiconductor package structure (2025-02-18),
5. 12165961 - Semiconductor package structure (2024-12-10),
6. 12095142 - Semiconductor package having discrete antenna device (2024-09-17),
7. 11967570 - Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure (2024-04-23),
8. 11908767 - Semiconductor package structure (2024-02-20),
9. 11908759 - Semiconductor device (2024-02-20),
10. 11776899 - Via array design for multi-layer redistribution circuit structure (2023-10-03),
11. 11721882 - Semiconductor package having discrete antenna device (2023-08-08),
12. 11710688 - Semiconductor package structure (2023-07-25),
13. 11705413 - Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure (2023-07-18),
14. 11509038 - Semiconductor package having discrete antenna device (2022-11-22),
15. 11302657 - Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure (2022-04-12),

Title: Inventor Hsing-Chih Liu

Introduction: Hsing-Chih Liu is a renowned inventor based in Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hsing-Chih Liu holds several patents in various technological domains, showcasing his continuous dedication to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Hsing-Chih Liu has worked on numerous projects that have revolutionized the tech industry. His keen eye for detail and inventive mindset have led to the development of cutting-edge solutions.

Collaborations: Throughout his career, Hsing-Chih Liu has collaborated with leading tech companies, research institutions, and universities, fostering a culture of innovation and knowledge-sharing within the industry.

Conclusion: Hsing-Chih Liu's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazer in the world of technology, inspiring future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…