The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2022
Filed:
May. 06, 2020
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Wen-Chou Wu, Hsinchu, TW;
Yi-Chieh Lin, Hsinchu, TW;
Chia-Yu Jin, Hsinchu, TW;
Hsing-Chih Liu, Hsinchu, TW;
Assignee:
MEDIATEK INC., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/498 (2006.01); H01Q 21/06 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 25/16 (2013.01); H01Q 21/06 (2013.01);
Abstract
A semiconductor package includes a bottom chip package having a first side and a second side opposing the first side. The bottom chip package comprises a first semiconductor chip and a second semiconductor chip arranged in a side-by-side manner on the second side. A top antenna package is mounted on the first side of the bottom chip package. The top antenna package comprises a radiative antenna element. A connector is disposed on the second side.