The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2023
Filed:
Dec. 14, 2021
Mediatek Inc., Hsin-Chu, TW;
Chia-Hao Hsu, Hsinchu, TW;
Tai-Yu Chen, Hsinchu, TW;
Shiann-Tsong Tsai, Hsinchu, TW;
Hsing-Chih Liu, Hsinchu, TW;
Yao-Pang Hsu, Hsinchu, TW;
Chi-Yuan Chen, Hsinchu, TW;
Chung-Fa Lee, Hsinchu, TW;
MEDIATEK INC., Hsin-Chu, TW;
Abstract
A semiconductor package including a base comprising an upper surface and a lower surface that is opposite to the upper surface; a radio-frequency (RF) module embedded near the upper surface of the base; an integrated circuit (IC) die mounted on the lower surface of the base in a flip-chip manner so that a backside of the IC die is available for heat dissipation; a plurality of conductive structures disposed on the lower surface of the base and arranged around the IC die; and a metal thermal interface layer comprising a backside metal layer that is in contact with the backside of the IC die, and a solder paste conformally printed on the backside metal layer.