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For the Inventor, By the Inventor

Taipei, Taiwan

Tai-Yu Chen

This inventor holds 53 USPTO granted patents and 28 published patent applications and 8 EPO patents, primarily in Semiconductor Packaging. Top assignees: Mediatek Corporation, Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tai-Yu Chen. Retrieved from https://idiyas.com/inventor/tai-yu-chen-7303icea

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 53 

% Patents Active = 98.1

 

Average Co-Inventor Count = 5.2

ph-index = 5

Forward Citations = 72(Granted Patents)


Location History:

  • Taipei, TW (2015 - 2021)
  • Hsinchu, TW (2022 - 2024)

Company Filing History:

goldMedal30 out of 5,102 
 
Mediatek Corporation
 patents
silverMedal18 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
bronzeMedal4 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents
4. 1 out of 988 
 
Mediatek Singapore Pte. Ltd.
 patents

Years Active: 2015-2026

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Areas of Expertise:
Semiconductor Processing
Thermal Control
Lithography
EUV Photolithography
Contamination Control
Chip Package
Thermal Management
Cooling Lid
3D Sensing
Dummy Thermal Features
Heat Dissipation
Packaging Substrate
53 patents (USPTO):Explore Patents
1. 12764974 - Semiconductor package having a thick logic die (2026-10-13),
2. 12748353 - System and method for monitoring and controlling extreme ultraviolet photolithography processes (2026-09-29),
3. 12702005 - Semiconductor package with vapor chamber lid (2026-08-04),
4. 12702000 - Semiconductor device and manufacturing method thereof (2026-08-04),
5. 12663711 - Method and system to for rapid inspection of photolithography reticle (2026-06-23),
6. 12648486 - Package-on-package having a thick logic die (2026-06-02),
7. 12591182 - Lithography contamination control (2026-03-31),
8. 12560868 - System and method for omnidirectional real time detection of photolithography characteristics (2026-02-24),
9. 12541152 - EUV lithography system with 3D sensing and tunning modules (2026-02-03),
10. 12422755 - Semiconductor processing tool and methods of operation (2025-09-23),
11. 12411474 - Integrated circuit configurable to perform adaptive thermal ceiling control in per-functional-block manner, associated main circuit, associated electronic device and associated thermal control method (2025-09-09),
12. 12372887 - Methods of cleaning a lithography system (2025-07-29),
13. 12372886 - Acoustic particle deflection in lithography tool (2025-07-29),
14. 12300573 - Semiconductor device and manufacturing method thereof (2025-05-13),
15. 12230560 - Semiconductor package structure (2025-02-18),

Title: Inventor Tai-Yu Chen: Revolutionizing Technology from Taipei, TW

Introduction: Tai-Yu Chen is a visionary inventor hailing from Taipei, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chen's latest patents focus on cutting-edge advancements in artificial intelligence, renewable energy solutions, and sustainable materials, showcasing his commitment to creating a more efficient and eco-friendly future.

Career Highlights: With over two decades of experience in research and development, Tai-Yu Chen has a proven track record of transforming innovative ideas into practical solutions. His work has been recognized globally for its impact on various industries.

Collaborations: Throughout his career, Chen has collaborated with leading tech companies, research institutions, and universities to push the boundaries of technological innovation. His partnerships have resulted in the development of pioneering products that have revolutionized the market.

Conclusion: Tai-Yu Chen's relentless pursuit of innovation and his passion for creating a better world through technology make him a true pioneer in the field of inventions. His work continues to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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