The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Mar. 01, 2023
Mediatek Inc., Hsin-Chu, TW;
Chin-Lai Chen, Hsinchu City, TW;
Wei-Che Huang, Hsinchu City, TW;
Wen-Sung Hsu, Hsinchu City, TW;
Chun-Yin Lin, Hsinchu City, TW;
Li-Song Lin, Hsinchu City, TW;
Tai-Yu Chen, Hsinchu City, TW;
MEDIATEK INC., Hsinchu City, TW;
Abstract
A semiconductor package includes a substrate having a top surface and a bottom surface. A semiconductor device is mounted on the top surface of the substrate. The semiconductor device has an active front surface directly facing the substrate, and an opposite rear surface. A vapor chamber lid is in thermal contact with the rear surface of the semiconductor device. The vapor chamber lid includes an internal vacuum-sealed cavity that stores a working fluid, and wick structures for recirculating the working fluid within the internal vacuum-sealed cavity.