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For the Inventor, By the Inventor

Zhubei, Taiwan

Wen-Sung Hsu

USPTO Granted Patents = 63 

 

Average Co-Inventor Count = 3.3

ph-index = 6

Forward Citations = 117(Granted Patents)

Forward Citations (Not Self Cited) = 73(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hsinchu County, TW (2016 - 2020)
  • Zhubei, TW (2015 - 2021)
  • Hsin-Chu, TW (2019 - 2024)

Company Filing History:

goldMedal63 out of 4,779 
 
Mediatek Corporation
 patents

Years Active: 2015-2025

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Areas of Expertise:
Semiconductor Package Structure
Chip Scale Package
Fan-Out Package
Interposer Technology
Thermal Features
Antenna Integration
Flip-Chip Technology
EMI Shielding
Heat Dissipation
Embedded Supporter
Manufacturing Method
Packaging Substrate
63 patents (USPTO):Explore Patents
1. 12444715 - Semiconductor package structure (2025-10-14),
2. 12300573 - Semiconductor device and manufacturing method thereof (2025-05-13),
3. 12136597 - Semiconductor package having an interposer in which one or more dies are formed and method of forming the same (2024-11-05),
4. 12080614 - Lidded semiconductor package (2024-09-03),
5. 12021068 - Semiconductor device with dummy thermal features on interposer (2024-06-25),
6. 12021031 - Semiconductor package structure (2024-06-25),
7. 11854930 - Semiconductor chip package and fabrication method thereof (2023-12-26),
8. 11854784 - Chip scale package structure and method of forming the same (2023-12-26),
9. 11837552 - Semiconductor package with layer structures, antenna layer and electronic component (2023-12-05),
10. 11830851 - Semiconductor package structure (2023-11-28),
11. 11791266 - Chip scale package structure and method of forming the same (2023-10-17),
12. 11742564 - Fan-out package structure with integrated antenna (2023-08-29),
13. 11670596 - Semiconductor package structure (2023-06-06),
14. 11652273 - Innovative air gap for antenna fan out package (2023-05-16),
15. 11574881 - Semiconductor package structure with antenna (2023-02-07),

Title: The Innovative Journey of Wen-Sung Hsu

Introduction: Wen-Sung Hsu, a talented inventor hailing from Zhubei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: As of the latest data, Wen-Sung Hsu holds several patents in various technological domains, showcasing his continuous dedication to innovation and creativity.

Career Highlights: Throughout his illustrious career, Wen-Sung Hsu has been recognized for his pioneering work in developing cutting-edge technologies that have revolutionized the industry. His inventions have not only pushed the boundaries of what is possible but have also improved the lives of many.

Collaborations: Wen-Sung Hsu has collaborated with leading tech companies, research institutions, and universities to further his research and bring his inventions to life. These collaborations have been instrumental in the success and impact of his work.

Conclusion: In conclusion, Wen-Sung Hsu stands as a beacon of innovation in the technological landscape, with a remarkable career marked by groundbreaking inventions, fruitful collaborations, and a relentless pursuit of excellence. His contributions continue to inspire and shape the future of technology.

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