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For the Inventor, By the Inventor

Zhubei, Taiwan

Wen-Sung Hsu

This inventor holds 68 USPTO granted patents and 20 published patent applications and 16 EPO patents, primarily in Semiconductor Packaging (CPC class H01L). Top assignee: Mediatek Corporation. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Sung Hsu. Retrieved from https://idiyas.com/inventor/wen-sung-hsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 68 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.4

ph-index = 6

Forward Citations = 130(Granted Patents)

Forward Citations (Not Self Cited) = 73(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hsinchu County, TW (2016 - 2020)
  • Zhubei, TW (2015 - 2021)
  • Hsin-Chu, TW (2019 - 2024)

Company Filing History:

goldMedal68 out of 5,091 
 
Mediatek Corporation
 patents

Years Active: 2015-2026

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Areas of Expertise:
Semiconductor Package
Flip-Chip Technology
Fan-Out Package
Thermal Management
Chip Scale Package
Antenna Integration
EMI Shielding
Heat Dissipation
Interposer Technology
Dummy Thermal Features
Layer Structures
Fabrication Methods
68 patents (USPTO):Explore Patents
1. 12702005 - Semiconductor package with vapor chamber lid (2026-08-04),
2. 12648486 - Package-on-package having a thick logic die (2026-06-02),
3. 12642125 - Semiconductor package structure (2026-05-26),
4. 12588522 - Semiconductor package structure (2026-03-24),
5. 12557215 - Semiconductor package using flip-chip technology (2026-02-17),
6. 12444715 - Semiconductor package structure (2025-10-14),
7. 12300573 - Semiconductor device and manufacturing method thereof (2025-05-13),
8. 12136597 - Semiconductor package having an interposer in which one or more dies are formed and method of forming the same (2024-11-05),
9. 12080614 - Lidded semiconductor package (2024-09-03),
10. 12021068 - Semiconductor device with dummy thermal features on interposer (2024-06-25),
11. 12021031 - Semiconductor package structure (2024-06-25),
12. 11854930 - Semiconductor chip package and fabrication method thereof (2023-12-26),
13. 11854784 - Chip scale package structure and method of forming the same (2023-12-26),
14. 11837552 - Semiconductor package with layer structures, antenna layer and electronic component (2023-12-05),
15. 11830851 - Semiconductor package structure (2023-11-28),

Title: The Innovative Journey of Wen-Sung Hsu

Introduction: Wen-Sung Hsu, a talented inventor hailing from Zhubei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: As of the latest data, Wen-Sung Hsu holds several patents in various technological domains, showcasing his continuous dedication to innovation and creativity.

Career Highlights: Throughout his illustrious career, Wen-Sung Hsu has been recognized for his pioneering work in developing cutting-edge technologies that have revolutionized the industry. His inventions have not only pushed the boundaries of what is possible but have also improved the lives of many.

Collaborations: Wen-Sung Hsu has collaborated with leading tech companies, research institutions, and universities to further his research and bring his inventions to life. These collaborations have been instrumental in the success and impact of his work.

Conclusion: In conclusion, Wen-Sung Hsu stands as a beacon of innovation in the technological landscape, with a remarkable career marked by groundbreaking inventions, fruitful collaborations, and a relentless pursuit of excellence. His contributions continue to inspire and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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