The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2026
Filed:
Feb. 02, 2023
Mediatek Inc., Hsinchu City, TW;
Tai-Yu Chen, Hsinchu City, TW;
Bo-Jiun Yang, Hsinchu City, TW;
Tsung-Yu Pan, Hsinchu City, TW;
Yin-Fa Chen, Hsinchu City, TW;
Ta-Jen Yu, Hsinchu City, TW;
Bo-Hao MA, Hsinchu City, TW;
Wen-Sung Hsu, Hsinchu City, TW;
Yao-Pang Hsu, Hsinchu City, TW;
MEDIATEK INC., Hsinchu City, TW;
Abstract
A high-bandwidth package-on-package (HBPoP) structure includes a first package structure and a second package structure disposed over the first package structure. The first package structure includes a first package substrate, a semiconductor die, an interposer, and a molding material. The first package substrate is formed of a silicon and/or ceramic material. The semiconductor die is disposed over the first package substrate. The interposer is disposed over the semiconductor die and is formed of a silicon and/or ceramic material. The molding material is disposed between the first package substrate and the interposer and surrounds the semiconductor die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile