This inventor holds 1 USPTO granted patent. Top assignee: Mediatek Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Bo-Hao MA and High-Bandwidth Packaging Innovation.
Introduction
Bo-Hao MA is an inventor based in Hsinchu City, Taiwan. His patent work includes semiconductor packaging technology, and he is associated with MediaTek Corporation.
Latest Patents
MA is named on one patent: High-bandwidth package-on-package structure. The invention describes a high-bandwidth package-on-package structure with a first package structure and a second package structure positioned above it. The first structure includes a package substrate and an interposer made of silicon and/or ceramic, a semiconductor die, and molding material that surrounds the die. The patent record lists 1 patent for MA.
Career Highlights
The available information connects MA’s invention to advanced semiconductor packaging, an area focused on integrating components and supporting high-bandwidth connections. His listed company is MediaTek Corporation.
Collaborations
The patent identifies MA as an inventor and lists no additional collaborators in the information provided. His association with MediaTek Corporation provides the stated company context for his work.
Conclusion
Bo-Hao MA’s patent describes a package-on-package design that combines a semiconductor die, substrate, interposer, and molding material to support high-bandwidth packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile