Hsinchu, Taiwan

Yao-Pang Hsu

USPTO Granted Patents = 7 

 

Average Co-Inventor Count = 5.7

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2022-2025

Loading Chart...
Loading Chart...
7 patents (USPTO):

Title: Innovative Contributions of Yao-Pang Hsu in Semiconductor Packaging

Introduction

Yao-Pang Hsu, a renowned inventor based in Hsinchu, Taiwan, has made significant strides in the field of semiconductor packaging. With a portfolio of six patents, Hsu has contributed innovative solutions that enhance the functionality and efficiency of semiconductor devices. His work at MediaTek Corporation underscores his commitment to advancing technology in this dynamic industry.

Latest Patents

Hsu's latest patents include groundbreaking designs that improve thermal management and usability in semiconductor packages. One notable invention is a lidded semiconductor package, which features a substrate with a semiconductor die mounted on its top surface. The package is designed with a two-part lid that offers easy access for modifications, allowing for the installation of a forced cooling module when necessary. This innovation facilitates better temperature control in semiconductor devices.

Another significant patent by Hsu is a semiconductor package that boasts an improved thermal interface between the semiconductor die and the heat spreading structure. This design incorporates a first semiconductor chip mounted in a flip-chip manner, with a second stacked chip that connects via wire bonding. An in-package heat dissipating element, consisting of a dummy silicon die, enhances thermal conductivity, ultimately leading to better performance and reliability of the semiconductor package.

Career Highlights

Hsu has established himself as a key player in the semiconductor industry through his inventive capabilities. His work at MediaTek Corporation has positioned him at the forefront of technological advancements, allowing him to influence the design and development of innovative semiconductor solutions. His continuous pursuit of excellence has earned him recognition among peers.

Collaborations

Throughout his career, Hsu has collaborated with fellow engineers such as Chia-Hao Hsu and Tai-Yu Chen. These collaborations have led to the successful development of various semiconductor technologies, further enhancing the capabilities of modern electronics. Together, they continue to push the boundaries of what is possible in semiconductor packaging.

Conclusion

Yao-Pang Hsu's contributions to the semiconductor industry reflect his dedication to innovation and excellence. With six patents to his name, he has played a crucial role in advancing semiconductor packaging technology. As the industry continues to evolve, the impact of Hsu's work will undoubtedly resonate within the realms of electronics and technology for years to come.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…