The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Feb. 23, 2023
Applicant:

Mediatek Inc., Hsin-Chu, TW;

Inventors:

Ya-Jui Hsieh, Hsinchu, TW;

Chi-Yuan Chen, Hsinchu, TW;

Shih-Chao Chiu, Hsinchu, TW;

Yao-Pang Hsu, Hsinchu, TW;

Assignee:

MEDIATEK INC., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 25/16 (2023.01); H01Q 9/04 (2006.01); H01Q 21/08 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/08 (2013.01); H01L 25/16 (2013.01); H01Q 9/0407 (2013.01);
Abstract

An antenna-in-module package-on-package includes an antenna package having a top surface and a bottom surface opposing the top surface. The antenna package includes a radiative antenna element on the bottom surface. A chip package is mounted on the top surface of the antenna package. The chip package includes a semiconductor chip. Conductive elements are disposed between the antenna package and the chip package to electrically interconnect the chip package and the antenna package. A radiative antenna element is disposed on the bottom surface of the antenna package. At least one air trench is disposed on the bottom surface of the antenna package.


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