Shih-Chao Chiu

Title: Innovations of Shih-Chao Chiu

Introduction

Shih-Chao Chiu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging and antenna technology. With a total of two patents to his name, Chiu's work reflects a commitment to advancing technology in his industry.

Latest Patents

Chiu's latest patents include an "Antenna-in-module package-on-package with air trenches" and a "Lidded semiconductor package." The antenna-in-module package-on-package features an antenna package with a radiative antenna element and a chip package mounted on its top surface. Conductive elements are strategically placed to interconnect the chip and antenna packages, while air trenches enhance the design. The lidded semiconductor package consists of a substrate with a semiconductor die and a two-part lid that can be removed for maintenance or upgrades, allowing for the installation of a forced cooling module.

Career Highlights

Chiu is currently employed at MediaTek Corporation, a leading global semiconductor company. His work at MediaTek has allowed him to focus on innovative solutions in the semiconductor field, contributing to the company's reputation for cutting-edge technology.

Collaborations

Chiu has collaborated with talented coworkers such as Chi-Yuan Chen and Ya-Jui Hsieh. Their combined expertise has fostered a productive environment for innovation and development.

Conclusion

Shih-Chao Chiu's contributions to semiconductor packaging and antenna technology demonstrate his innovative spirit and dedication to advancing the field. His patents reflect a deep understanding of the complexities involved in modern technology.