Mediatek Corporation

Shih-Chao Chiu

Chi-Yuan Chen

Yao-Pang Hsu

Ya-Jui Hsieh

Wen-Chun Huang

Wen-Sung Hsu

Yi-Lin Tsai

Sang-Mao Chiu

An antenna-in-module package-on-package includes an antenna package having a top surface and a bottom surface opposing the top surface. The antenna package includes a radiative antenna element on the bottom surface. A chip package is mounted on the top surface of the antenna package. The chip package includes a semiconductor chip. Conductive elements are disposed between the antenna package and the chip package to electrically interconnect the chip package and the antenna package. A radiative antenna element is disposed on the bottom surface of the antenna package. At least one air trench is disposed on the bottom surface of the antenna package.

Antenna-in-module package-on-package with air trenches

A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

Lidded semiconductor package

Growing community of inventors

Hsinchu, Taiwan

Shih-Chao Chiu