The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Oct. 05, 2021
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Shih-Chao Chiu, Hsinchu, TW;
Chi-Yuan Chen, Hsinchu, TW;
Wen-Sung Hsu, Hsinchu, TW;
Ya-Jui Hsieh, Hsinchu, TW;
Yao-Pang Hsu, Hsinchu, TW;
Wen-Chun Huang, Hsinchu, TW;
Assignee:
MEDIATEK INC., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01);
U.S. Cl.
CPC ...
H01L 23/31 (2013.01); H01L 23/4006 (2013.01); H01L 23/473 (2013.01); H05K 5/0052 (2013.01); H05K 5/0221 (2013.01); H05K 5/03 (2013.01);
Abstract
A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.