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For the Inventor, By the Inventor

Tainan, Taiwan

Wen-Chun Huang

This inventor holds 94 USPTO granted patents and 5 published patent applications, primarily in Integrated Circuit Design (CPC class G03F1-36). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Haynes and Boone, LLP, Mediatek Corporation. Active years: 2011-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Chun Huang. Retrieved from https://idiyas.com/inventor/wen-chun-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 94 

% Patents Active = 58.5

Average Co-Inventor Count = 6.6

ph-index = 19

Forward Citations = 1,156(Granted Patents)

Forward Citations (Not Self Cited) = 1,070(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Jhongli, TW (2015)
  • Xi-Gang Village, TW (2015)
  • Xi-Gang Xiang, TW (2011 - 2016)
  • Tainan County, TW (2012 - 2016)
  • Tainan, TW (2012 - 2023)
  • Hsinchu, TW (2016 - 2024)

Company Filing History:

goldMedal92 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 5 
 
Haynes and Boone, LLP
 patents
bronzeMedal1 out of 5,102 
 
Mediatek Corporation
 patents
4. 1 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 2011-2025

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Areas of Expertise:
Integrated Circuit Design
Semiconductor Packaging
Optical Proximity Correction
Pattern Density Optimization
Multiple Patterning
EUV Lithography
Machine Learning
Mandrel Mask Generation
Colorability Determination
E-Beam Lithography
Environmental-Aware OPC
Interconnect Structure
94 patents (USPTO):Explore Patents
1. 12438000 - Methods for integrated circuit design and fabrication (2025-10-07),
2. 12159092 - Method for coloring circuit layout and system for performing the same (2024-12-03),
3. 12080614 - Lidded semiconductor package (2024-09-03),
4. 11790145 - Method for coloring circuit layout and system for performing the same (2023-10-17),
5. 11392742 - Method for coloring circuit layout and system for performing the same (2022-07-19),
6. 11308256 - Method of post optical proximity correction (OPC) printing verification by machine learning (2022-04-19),
7. 11048161 - Optical proximity correction methodology using pattern classification for target placement (2021-06-29),
8. 10930505 - Methods for integrated circuit design and fabrication (2021-02-23),
9. 10860774 - Methodology for pattern density optimization (2020-12-08),
10. 10817635 - Multiple patterning method for semiconductor devices (2020-10-27),
11. 10796055 - Method for coloring circuit layout and system for performing the same (2020-10-06),
12. 10747938 - Method for integrated circuit manufacturing (2020-08-18),
13. 10691864 - Method of post optical proximity correction (OPC) printing verification by machine learning (2020-06-23),
14. 10527928 - Optical proximity correction methodology using pattern classification for target placement (2020-01-07),
15. 10520829 - Optical proximity correction methodology using underlying layer information (2019-12-31),

Title: Wen-Chun Huang: Inspiring Innovations in Circuit Layouts

Introduction:

Wen-Chun Huang, a visionary inventor based in Tainan, Taiwan, is renowned for his relentless passion for innovation and excellence. With an impressive portfolio of 91 patents, he continues to inspire future generations of inventors and researchers not only in Taiwan but globally.

Latest Patents:

Among his latest patents is a groundbreaking "Method for coloring circuit layout and system for performing the same." This innovation revolutionizes the sorting and pre-coloring of nodes in G0-linked networks in multiple-patterning technology (MPT)-compliant layout designs. By utilizing a coordinate-based method, Huang's invention ensures that immediately adjacent linked nodes in a network have different features, enhancing efficiency in circuit layout design.

Career Highlights:

Having worked in prestigious companies like Taiwan Semiconductor Manufacturing Company Limited (TSMC) and Haynes and Boone, Llp, Huang has honed his skills and expertise in the field of semiconductor technology. His relentless pursuit of excellence has led to numerous groundbreaking inventions that have significantly impacted the industry.

Collaborations:

Throughout his illustrious career, Huang has collaborated with industry experts such as Ru-Gun Liu and Ming-Hui Chih. These collaborations have not only enriched his own understanding of circuit design but have also contributed to the collective pool of knowledge in the field.

Conclusion:

In conclusion, Wen-Chun Huang's dedication to innovation and his remarkable contributions to the field of circuit layout design serve as a testament to his pioneering spirit. His inventive approach continues to inspire and shape the future of technological advancements, paving the way for a new era of innovation in Taiwan and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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