The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Aug. 09, 2018
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Hung-Chun Wang, Taichung, TW;
Ming-Hui Chih, Luzhou, TW;
Ping-Chieh Wu, Zhubei, TW;
Chun-Hung Wu, Hsinchu, TW;
Wen-Hao Liu, Zhubei, TW;
Cheng-Hsuan Huang, New Taipei, TW;
Cheng-Kun Tsai, Hsinchu, TW;
Wen-Chun Huang, Tainan, TW;
Ru-Gun Liu, Zhubei, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
The present disclosure relates to a method of data preparation. The method, in some embodiments, performs a first data preparation process using a data preparation element. The first data preparation process modifies a plurality of shapes of an integrated chip (IC) design that comprises a graphical representation of a layout used to fabricate an integrated chip. A plurality of additional shapes are added to the IC design using an additional shape insertion element. The plurality of additional shapes are separated from the plurality of shapes by one or more non-zero distances. A second data preparation process is performed using the data preparation element, after performing the first data preparation process. The second data preparation process modifies the plurality of additional shapes.