Company Filing History:
Years Active: 2012-2020
Title: Cheng-Kun Tsai: Innovator in Integrated Circuit Design
Introduction
Cheng-Kun Tsai is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit (IC) design, holding a total of 7 patents. His work focuses on methodologies that enhance the efficiency and effectiveness of IC fabrication processes.
Latest Patents
Cheng-Kun Tsai's latest patents include innovative methodologies for pattern density optimization. One of his notable patents describes a method of data preparation that modifies various shapes within an IC design. This process involves adding additional shapes that are strategically separated from existing shapes by non-zero distances. Another patent outlines a method for improving pattern density with a low optical proximity correction (OPC) cycle time. This method identifies low-pattern-density areas in an IC design and incorporates dummy shapes to enhance the overall design integrity.
Career Highlights
Cheng-Kun Tsai is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His expertise in IC design has positioned him as a valuable asset within the company, contributing to advancements in semiconductor technology.
Collaborations
Cheng-Kun Tsai has collaborated with notable colleagues, including Ming-Hui Chih and Wen-Chun Huang. These collaborations have fostered innovation and have led to the development of cutting-edge technologies in the semiconductor field.
Conclusion
Cheng-Kun Tsai's contributions to integrated circuit design through his innovative patents and collaborations highlight his role as a key inventor in the semiconductor industry. His work continues to influence advancements in technology and design methodologies.