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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chi-Yuan Chen

This inventor holds 29 USPTO granted patents and 12 published patent applications and 3 EPO patents, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Mediatek Corporation, National Tsing Hua University. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chi-Yuan Chen. Retrieved from https://idiyas.com/inventor/chi-yuan-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 79.3

 

Average Co-Inventor Count = 5.9

ph-index = 5

Forward Citations = 65(Granted Patents)


Location History:

  • Taichung, TW (2018)
  • New Taipei, TW (2020)
  • Hsinchu, TW (2013 - 2024)

Company Filing History:

goldMedal18 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal9 out of 5,102 
 
Mediatek Corporation
 patents
bronzeMedal1 out of 1,308 
 
National Tsing Hua University
 patents
4. 1 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2013-2026

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Areas of Expertise:
Fin Field-Effect Transistor
Thermal Interface
Semiconductor Device
Contact Structure
Antenna-in-Module
Package-on-Package
Rigid Under Bump Metallurgy
Gap Filling Improvement
CMOS Device
Chemical Mechanical Polish
Epitaxial Layers
Immunogenicity
29 patents (USPTO):Explore Patents
1. 12765437 - Semiconductor device and manufacturing method thereof (2026-10-13),
2. 12677461 - Fin field-effect transistor device and methods of forming (2026-07-07),
3. 12635207 - Semiconductor devices and methods of fabricating the same (2026-05-19),
4. 12588522 - Semiconductor package structure (2026-03-24),
5. 12388194 - Antenna-in-module package-on-package with air trenches (2025-08-12),
6. 12080614 - Lidded semiconductor package (2024-09-03),
7. 11967570 - Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure (2024-04-23),
8. 11705413 - Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure (2023-07-18),
9. 11444028 - Contact structure and formation thereof (2022-09-13),
10. 11302657 - Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure (2022-04-12),
11. 11227846 - Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure (2022-01-18),
12. 10756040 - Semiconductor package with rigid under bump metallurgy (UBM) stack (2020-08-25),
13. 10510664 - Contact structure and formation thereof (2019-12-17),
14. 10283359 - Systems and methods for gap filling improvement (2019-05-07),
15. 10157995 - Integrating junction formation of transistors with contact formation (2018-12-18),

Title: The Innovative Journey of Inventor Chi-Yuan Chen

Introduction: Chi-Yuan Chen, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents: Chi-Yuan Chen holds several patents in the areas of semiconductor technology, renewable energy, and advanced materials. His most recent patents focus on cutting-edge developments in nanotechnology and artificial intelligence.

Career Highlights: With a background in engineering and a passion for pushing the boundaries of what is possible, Chi-Yuan Chen has had a distinguished career marked by groundbreaking inventions. He has worked for leading tech companies and research institutions, where his innovative spirit has led to the creation of revolutionary technologies.

Collaborations: Throughout his career, Chi-Yuan Chen has collaborated with top researchers, engineers, and scientists from around the world. His ability to work in multidisciplinary teams has resulted in the successful development of novel solutions to complex technological challenges.

Conclusion: Chi-Yuan Chen's relentless pursuit of innovation and his commitment to pushing the limits of technology have established him as a visionary inventor in the global innovation landscape. His work continues to inspire future generations of inventors and researchers to think boldly and create fearlessly.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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