The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Sep. 27, 2023
Applicant:
Mediatek Inc., Hsinchu City, TW;
Inventors:
Assignee:
MEDIATEK INC., Hsinchu City, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/40 (2026.01); H10W 72/50 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 90/811 (2026.01); H10W 70/415 (2026.01); H10W 70/468 (2026.01); H10W 72/50 (2026.01); H10W 70/417 (2026.01); H10W 74/111 (2026.01); H10W 90/701 (2026.01);
Abstract
A semiconductor device is provided. The semiconductor device includes a carrier, an electronic component, an adapter, a first metal wire and a second metal wire. The electronic component is disposed on the carrier. The adapter is disposed on the carrier. The first metal wire connects the electronic component and the adapter. The second metal wire connects the adapter and the carrier.
Huang, Pu-Shan. (2026). Semiconductor device and manufacturing method thereof (U.S. Patent No. 12765437). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765437
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile