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For the Inventor, By the Inventor

Taoyuan, Taiwan

Shih-Chin Lin

This inventor holds 24 USPTO granted patents and 20 published patent applications and 4 EPO patents, primarily in Semiconductor Packaging. Top assignees: Mediatek Corporation, Faraday Technology Corporation, Mediatek Singapore Pte. Ltd.. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shih-Chin Lin. Retrieved from https://idiyas.com/inventor/shih-chin-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 95.8

 

Average Co-Inventor Count = 3.8

ph-index = 4

Forward Citations = 34(Granted Patents)


Location History:

  • Daxi Township, Taoyuan County, TW (2015)
  • Taoyuan County, TW (2016)
  • Taoyuan, TW (2015 - 2019)
  • Hsinchu, TW (2016 - 2024)

Company Filing History:

goldMedal22 out of 5,091 
 
Mediatek Corporation
 patents
silverMedal1 out of 411 
 
Faraday Technology Corporation
 patents
bronzeMedal1 out of 985 
 
Mediatek Singapore Pte. Ltd.
 patents

Years Active: 2015-2026

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Areas of Expertise:
Graphics Processor
Chip Scale Package
AI Frame Engine
Semiconductor Device
Thermal Management
Depth Analyzer
Solder Ball
Board Level Reliability
Package-on-Package
Interposer
Electronic Apparatus
24 patents (USPTO):Explore Patents
1. 12749139 - Computing system and method for graphics processor boosting (2026-09-29),
2. 12648486 - Package-on-package having a thick logic die (2026-06-02),
3. 12118653 - Depth analyzer and shading rate controller (2024-10-15),
4. 12021068 - Semiconductor device with dummy thermal features on interposer (2024-06-25),
5. 11983848 - AI frame engine for mobile edge (2024-05-14),
6. 11869831 - Semiconductor package with improved board level reliability (2024-01-09),
7. 11854784 - Chip scale package structure and method of forming the same (2023-12-26),
8. 11580621 - AI frame engine for mobile edge (2023-02-14),
9. 10354974 - Structure and formation method of chip package structure (2019-07-16),
10. 10312222 - Semiconductor package and semiconductor device using the same (2019-06-04),
11. 10242927 - Semiconductor package, semiconductor device using the same and manufacturing method thereof (2019-03-26),
12. 10186488 - Manufacturing method of semiconductor package and manufacturing method of semiconductor device (2019-01-22),
13. 10121222 - Bandwidth efficient method for generating an alpha hint buffer (2018-11-06),
14. 10027330 - Arbitrating circuit (2018-07-17),
15. 9908203 - Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof (2018-03-06),

Title: The Innovative Journey of Shih-Chin Lin

Introduction: Shih-Chin Lin, a pioneering inventor from Taoyuan, TW, has made significant contributions to the field of technology with her groundbreaking innovations.

Latest Patents: Shih-Chin Lin holds several patents in the areas of renewable energy, sustainable materials, and smart devices, showcasing her versatility and forward-thinking approach to invention.

Career Highlights: With a background in engineering and a passion for sustainability, Shih-Chin Lin has led numerous research projects that have resulted in cutting-edge solutions for environmental challenges. Her dedication to creating a more sustainable future has earned her recognition in the industry.

Collaborations: Throughout her career, Shih-Chin Lin has collaborated with leading research institutions, universities, and companies to bring her inventions to life. Her ability to work across disciplines and industries has led to the development of innovative technologies with real-world applications.

Conclusion: Shih-Chin Lin's innovative spirit, dedication to sustainability, and collaborative approach to invention have established her as a trailblazer in the world of technology. Her work continues to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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