The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Nov. 17, 2022
Mediatek Inc., Hsin-Chu, TW;
Yen-Yao Chi, Hsin-Chu, TW;
Nai-Wei Liu, Hsin-Chu, TW;
Ta-Jen Yu, Hsin-Chu, TW;
Tzu-Hung Lin, Hsin-Chu, TW;
Wen-Sung Hsu, Hsin-Chu, TW;
Shih-Chin Lin, Hsinchu, TW;
MediaTek Inc., Hsin-Chu, TW;
Abstract
A semiconductor package structure includes a semiconductor die, a redistribution layer (RDL) structure, a protective insulating layer, and a conductive structure. The semiconductor die has a first surface, a second surface opposite the first surface, and a third surface adjoined between the first surface and the second surface. The RDL structure is on the first surface of the semiconductor die and is electrically coupled to the semiconductor die. The protective insulating layer covers the RDL structure, the second surface and the third surface of the semiconductor die. The conductive structure passes through the protective insulating layer and is electrically coupled to the RDL structure.