Tzu-Hung Lin

This inventor holds 96 USPTO granted patents and 18 published patent applications and 26 EPO patents, primarily in Semiconductor Packaging (CPC class H01L24-16). Top assignees: Mediatek Corporation, Mediatek Singapore Pte. Ltd.. Active years: 2013-2026.

USPTO Granted Patents = 96 (Patent Applications = 18)

% Patents Active = 100.0

EPO Patents = 26 (Patent Applications = 53)

Average Co-Inventor Count = 3.1

ph-index = 7

Forward Citations = 217(Granted Patents)

Forward Citations (Not Self Cited) = 146(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Hsinchu County, TW (2013 - 2020)
Zhubei, TW (2014 - 2024)
Hsin-Chu, TW (2019 - 2024)

Company Filing History:

Mediatek Singapore Pte. Ltd.

patents

Years Active: 2013-2026

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Areas of Expertise:

Semiconductor Package Structure

Integrated Antenna

Chip Scale Package

Fan-Out Package

Electromagnetic Shield

Annular Frame

Fabrication Method

Lid Structure

Trace Bump Interconnection

Air Gap

Stacked Package

Conductive Shield Layer

96 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12525549 - Semiconductor package structure (2026-01-13),

2. 12500180 - Semiconductor package with integrated antenna and shielding pillars (2025-12-16),

3. 12424531 - Semiconductor package structure (2025-09-23),

4. 12142598 - Semiconductor package structure having an annular frame with truncated corners (2024-11-12),

5. 12002742 - Semiconductor package structure (2024-06-04),

6. 11948895 - Semiconductor package structure (2024-04-02),

7. 11942439 - Semiconductor package structure (2024-03-26),

8. 11862578 - Semiconductor package structure (2024-01-02),

9. 11854784 - Chip scale package structure and method of forming the same (2023-12-26),

10. 11824020 - Semiconductor package structure including antenna (2023-11-21),

11. 11791266 - Chip scale package structure and method of forming the same (2023-10-17),

12. 11742564 - Fan-out package structure with integrated antenna (2023-08-29),

13. 11728292 - Semiconductor package assembly having a conductive electromagnetic shield layer (2023-08-15),

14. 11688655 - Semiconductor package including lid structure with opening and recess (2023-06-27),

15. 11652273 - Innovative air gap for antenna fan out package (2023-05-16),

Title: The Innovative Journey of Tzu-Hung Lin

Introduction: Tzu-Hung Lin, a talented inventor hailing from Zhubei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Tzu-Hung Lin's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: Throughout his illustrious career, Tzu-Hung Lin has been recognized for his exceptional problem-solving skills and creativity, leading to the development of revolutionary products that have had a profound impact on various industries.

Collaborations: Tzu-Hung Lin has collaborated with leading research institutions, universities, and tech companies around the world, fostering a culture of innovation and knowledge-sharing that has propelled his inventions to new heights.

Conclusion: Tzu-Hung Lin's passion for innovation, coupled with his dedication to pushing the boundaries of what is possible, has solidified his reputation as a visionary inventor whose work will continue to inspire future generations in the ever-evolving world of technology.