The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
Feb. 18, 2022
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Nai-Wei Liu, Hsin-Chu, TW;
Yen-Yao Chi, Hsin-Chu, TW;
Yeh-Chun Kao, Hsin-Chu, TW;
Shih-Huang Yeh, Hsin-Chu, TW;
Tzu-Hung Lin, Hsin-Chu, TW;
Wen-Sung Hsu, Hsin-Chu, TW;
Assignee:
MediaTek Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01Q 9/28 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/20 (2013.01); H01Q 1/38 (2013.01); H01Q 9/285 (2013.01); H01L 23/3128 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/211 (2013.01); H01L 2224/215 (2013.01); H01L 2224/221 (2013.01); H01L 2924/01029 (2013.01);
Abstract
A semiconductor package structure is provided. The semiconductor package structure includes a redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. An antenna structure includes a first antenna element formed in the RDL structure, a first insulating layer covering the RDL structure, a second insulating layer formed on the first insulating layer, and a second antenna element formed on and in direct contact with the second insulating layer.