Company Filing History:
Years Active: 2021-2023
Title: Yen-Yao Chi: Innovating Semiconductor Packaging
Introduction
Yen-Yao Chi, an accomplished inventor based in Hsin-Chu, Taiwan, has made significant contributions to the semiconductor industry. With a remarkable portfolio of 11 patents, his work exemplifies innovation and technical excellence in semiconductor package structures.
Latest Patents
Yen-Yao Chi's latest patents demonstrate his expertise in semiconductor packaging. One of his notable inventions is the "Chip Scale Package Structure and Method of Forming the Same." This innovative semiconductor package structure includes a semiconductor die, a redistribution layer (RDL) structure, a protective insulating layer, and a conductive structure. The design emphasizes the electrical coupling of the RDL to the semiconductor die, while the protective layer enhances durability.
Another significant patent is for a "Semiconductor Package Structure Including Antenna." This invention features an electronic device equipped with an antenna device that comprises a conductive pattern layer with a first antenna element adjacent to an insulating substrate's first surface and a second antenna element on the opposite surface. The semiconductor package further integrates the RDL structure and electronic components, encapsulating them to ensure enhanced functionality and reliability.
Career Highlights
Yen-Yao Chi has spent a substantial part of his career with MediaTek Corporation, where he has been instrumental in advancing semiconductor technologies. His innovative designs and methods have not only contributed to the growth of the company but have also set new standards within the industry.
Collaborations
Throughout his career, Yen-Yao Chi has collaborated with talented professionals, including Nai-Wei Liu and Tzu-Hung Lin, who have worked alongside him at MediaTek Corporation. These collaborations have fostered an environment of creativity and innovation, leading to successful patent developments and advancements in semiconductor technology.
Conclusion
Yen-Yao Chi's contributions to the semiconductor industry, through his remarkable patents and collaborations, illustrate his role as a leading innovator. His inventions are paving the way for future advancements in semiconductor packaging, positioning him as a key figure in this dynamic field of technology.