The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
Nov. 03, 2016
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Assignee:
MediaTek Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 21/304 (2006.01); H01L 21/78 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H01L 21/304 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/3135 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/562 (2013.01); H01L 24/94 (2013.01); H01L 25/0657 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/73153 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1533 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A semiconductor package includes a substrate, a first electronic component, a film and a package body. The first electronic component is disposed on the substrate and has an upper surface. The film is disposed on the upper surface of the first electronic component. The package body encapsulates the first electronic component and the film.