Ming-Jen Hsiung

Title: The Innovations of Ming-Jen Hsiung

Introduction

Ming-Jen Hsiung is a prominent inventor based in Zhubei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on advanced packaging techniques that enhance the performance and efficiency of electronic devices.

Latest Patents

One of his latest patents is a "Wafer-level chip-size package with redistribution layer." This innovative design includes a semiconductor structure with a bonding pad formed over it, featuring multiple conductive segments. A conductive component is positioned adjacent to the bonding pad, and a passivation layer is created to expose portions of the conductive segments. A conductive redistribution layer is then formed over these exposed segments, followed by a planarization layer and a UBM layer, culminating in a conductive bump formed over the UBM layer.

Another notable patent is for a "Semiconductor package, semiconductor device using the same and manufacturing method thereof." This patent describes a semiconductor package that consists of a substrate, a first electronic component, a film, and a package body. The first electronic component is placed on the substrate, and the film is positioned on its upper surface. The package body encapsulates both the first electronic component and the film, providing a robust solution for electronic device assembly.

Career Highlights

Ming-Jen Hsiung is currently employed at MediaTek Corporation, a leading global semiconductor company. His work at MediaTek has allowed him to push the boundaries of semiconductor packaging technology, contributing to the development of cutting-edge electronic devices.

Collaborations

Throughout his career, Ming-Jen has collaborated with talented colleagues such as Yan-Liang Ji and Wen-Sung Hsu. These collaborations have fostered an environment of innovation and creativity, leading to the successful development of new technologies.

Conclusion

Ming-Jen Hsiung's contributions to semiconductor technology through his patents and work at MediaTek Corporation highlight his role as a key innovator in the field. His advancements in packaging techniques continue to influence the design and functionality of modern electronic devices.