The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Sep. 23, 2016
Mediatek Inc., Hsin-Chu, TW;
Yan-Liang Ji, Hsinchu, TW;
Ming-Jen Hsiung, Zhubei, TW;
MEDIATEK INC., Hsin-Chu, TW;
Abstract
A Wafer-level chip scale package (WLCSP) includes a semiconductor structure and a first bonding pad formed over a portion of the semiconductor structure. The WLCSP further includes a passivation layer formed over the semiconductor structure and the first bonding pad, exposing portions of the first bonding pad. The WLCSP further includes a conductive redistribution layer formed over the passivation layer and the portions of the first bonding pad exposed by the passivation layer. The WLCSP further includes a planarization layer formed over the passivation layer and the conductive redistribution layer, exposing a portion of the conductive redistribution layer. The WLCSP further includes an under-bump-metallurgy (UBM) layer formed over the planarization layer and a conductive bump formed over the UBM layer.