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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10186488 B1

PDFFull Text
Date of Patent:
Jan. 22, 2019

Filed:

Aug. 09, 2017

Manufacturing method of semiconductor package and manufacturing method of semiconductor device

Applicant:

Mediatek Inc., Hsin-Chu, TW;

Inventors:

Wen-Sung Hsu, Zhubei, TW;

Shih-Chin Lin, Taoyuan, TW;

Tao Cheng, Zhubei, TW;

Andrew C. Chang, Hsinchu, TW;

Assignee:

MEDIATEK INC., Hsin-Chu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Sonya D McCall-Shepard

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/00 (2006.01); H01L 25/00 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/14 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/486 (2013.01); H01L 21/4846 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/145 (2013.01); H01L 23/3114 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 25/0657 (2013.01); H01L 25/10 (2013.01); H01L 25/105 (2013.01); H01L 25/16 (2013.01); H01L 25/162 (2013.01); H01L 25/165 (2013.01); H01L 25/50 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/81005 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1533 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19106 (2013.01);
Abstract

A manufacturing method of a semiconductor package includes the follow steps. Firstly, a carrier is provided. Then, a package substrate is formed. Then, a first electronic component is disposed above the second conductive layer of the package substrate. Then, a second package body encapsulating the first electronic component and the second conductive layer is formed. Then, the carrier is carried. Wherein in the step of forming the package substrate includes a step of forming a first conductive layer on the carrier, a step of forming a first pillar layer on the first conductive layer, a step of forming a first package body encapsulating the first conductive layer and the first pillar layer and a step of forming a second conductive layer on the first pillar layer.

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