Tao Cheng

Title: Innovations by Tao Cheng in Semiconductor Packaging

Introduction

Tao Cheng is a prolific inventor based in Hsinchu, Taiwan, with a remarkable portfolio of 32 patents. His contributions to the field of semiconductor technology have significantly impacted the industry, especially in the realm of integrated electronic components.

Latest Patents

Among his latest patents, one noteworthy innovation is a semiconductor package with layer structures, an antenna layer, and an electronic component. This invention details a semiconductor package that includes a first substrate, a first layer structure, a second layer structure, a first antenna layer, and an electronic component. The first antenna layer is designed to be formed on one or both of the layer structures, ensuring that its upper surface is flush with either the first or second layer structure. Additionally, the electronic component is strategically positioned on the substrate's lower surface, allowing it to be exposed from the first substrate. The incorporation of these features makes for a sophisticated semiconductor package optimized for performance.

Career Highlights

Tao Cheng has made significant strides in his career, working with renowned companies such as MediaTek Corporation and MediaTek Incorporation. His expertise and innovative spirit have helped drive advancements in semiconductor technology, further establishing his status as an influential inventor in the field.

Collaborations

Throughout his career, Cheng has collaborated with esteemed professionals, including Wen-Sung Hsu and Ching-Chung Ko. These partnerships highlight his commitment to teamwork and innovation within the semiconductor sector.

Conclusion

Tao Cheng's contributions to semiconductor packaging and his impressive patent portfolio underline his role as a key innovator in technology. His latest inventions demonstrate a profound understanding of complex electronic systems, ensuring that he remains a vital figure in the ongoing evolution of the industry.