The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Dec. 09, 2013
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventor:
Tao Cheng, Hsinchu, TW;
Assignee:
MEDIATEK INC., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/495 (2006.01); G06F 17/50 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/025 (2013.01); G06F 17/5077 (2013.01); H01L 23/49541 (2013.01); H01L 23/64 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/19051 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/30107 (2013.01);
Abstract
A leadframe for semiconductor packages is provided. The leadframe includes a die pad, a side rail, a tie bar, and a plurality of leads. The side rail is around the die pad. The tie bar connects the die pad and the side rail. The leads extend from the side rail to close proximity to the die pad. The leads includes a first lead and a second lead being at opposite locations of the leadframe relative to a center line through the die pad. The first and second leads are substantially asymmetrical with each other relative to the center line and have different impedance values. The plurality of leads are disconnected from each other.