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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10784206 B1

PDFFull Text
Date of Patent:
Sep. 22, 2020

Filed:

Oct. 18, 2018

Semiconductor package

Applicant:

Mediatek Inc., Hsinchu, TW;

Inventors:

Wen-Sung Hsu, Hsinchu, TW;

Tao Cheng, Hsinchu, TW;

Nan-Cheng Chen, Hsinchu, TW;

Che-Ya Chou, Hsinchu, TW;

Wen-Chou Wu, Hsinchu, TW;

Yen-Ju Lu, Hsinchu, TW;

Chih-Ming Hung, San Jose, CA (US);

Wei-Hsiu Hsu, Hsinchu, TW;

Assignee:

MEDIATEK INC., Hsinchu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Sonya McCall-Shepard

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/683 (2006.01); H01Q 9/04 (2006.01); H01L 23/498 (2006.01); H01Q 1/22 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01); H01L 23/50 (2006.01); H01Q 21/06 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 23/66 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/486 (2013.01); H01L 21/4846 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 23/5383 (2013.01); H01L 23/66 (2013.01); H01L 25/0657 (2013.01); H01L 25/10 (2013.01); H01L 25/105 (2013.01); H01L 25/16 (2013.01); H01L 25/162 (2013.01); H01L 25/165 (2013.01); H01L 25/50 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H01Q 9/0414 (2013.01); H01L 23/145 (2013.01); H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/81005 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1533 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19106 (2013.01); H01Q 21/065 (2013.01);
Abstract

A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.

Find Patent Forward Citations

Hsu, Wen-Sung. (2020). Semiconductor package (U.S. Patent No. 10784206). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10784206

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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