The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Nov. 01, 2011
Ching-chung Ko, Hsinchu County, TW;
Tao Cheng, Hsinchu, TW;
Tien-yueh Liu, Hsinchu, TW;
Ta-hsi Chou, New Taipei, TW;
Peng-cheng Kao, Hsinchu, TW;
Ling-wei KE, Hsinchu County, TW;
Ching-Chung Ko, Hsinchu County, TW;
Tao Cheng, Hsinchu, TW;
Tien-Yueh Liu, Hsinchu, TW;
Ta-Hsi Chou, New Taipei, TW;
Peng-Cheng Kao, Hsinchu, TW;
Ling-Wei Ke, Hsinchu County, TW;
MEDIATEK INC., Hsin-Chu, TW;
Abstract
An integrated circuit chip includes a semiconductor substrate having thereon a plurality of IMD layers and a plurality of first conductive layers; a first passivation layer overlying the plurality of IMD layers and the first conductive layers; at least a first power/ground mesh wiring line in a first aluminum layer overlying the first Insulating layer; and at least a second power/ground mesh wiring line in a second aluminum layer overlying the first aluminum layer.