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For the Inventor, By the Inventor

Hsinchu, Taiwan

Tien-Yueh Liu

This inventor holds 8 USPTO granted patents. Top assignees: Mediatek Corporation, Silicon Integrated Systems Corporation. Active years: 2004-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tien-Yueh Liu. Retrieved from https://idiyas.com/inventor/tien-yueh-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8

% Patents Active = 87.5

Average Co-Inventor Count = 5.3

ph-index = 3

Forward Citations = 27(Granted Patents)


Company Filing History:

goldMedal7 out of 5,102 
 
Mediatek Corporation
 patents
silverMedal1 out of 295 
 
Silicon Integrated Systems Corporation
 patents

Years Active: 2004-2018

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8 patents (USPTO):Explore Patents
1. 10002833 - Power and ground routing of integrated circuit devices with improved IR drop and chip performance (2018-06-19),
2. 9698102 - Power and ground routing of integrated circuit devices with improved IR drop and chip performance (2017-07-04),
3. 9379059 - Power and ground routing of integrated circuit devices with improved IR drop and chip performance (2016-06-28),
4. 8661388 - Method of packing-based macro placement and semiconductor chip using the same (2014-02-25),
5. 8120067 - Power and ground routing of integrated circuit devices with improved IR drop and chip performance (2012-02-21),
6. 8072004 - Power and ground routing of integrated circuit devices with improved IR drop and chip performance (2011-12-06),
7. 7821038 - Power and ground routing of integrated circuit devices with improved IR drop and chip performance (2010-10-26),
8. 6708312 - Method for multi-threshold voltage CMOS process optimization (2004-03-16),

Title: Tien-Yueh Liu: Innovator in Integrated Circuit Technology

Introduction

Tien-Yueh Liu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit technology, holding a total of eight patents. His work focuses on improving the performance and efficiency of integrated circuits, which are essential components in modern electronic devices.

Latest Patents

One of Tien-Yueh Liu's latest patents is titled "Power and ground routing of integrated circuit devices with improved IR drop and chip performance." This invention describes an integrated circuit chip that includes a semiconductor substrate with multiple inter-metal dielectric (IMD) layers and first conductive layers made of copper. The design features a first insulating layer over the IMD layers and conductive layers, along with wiring lines in a second conductive layer made of aluminum for distributing power and ground signals. This innovative approach aims to enhance chip performance by addressing issues related to IR drop.

Career Highlights

Throughout his career, Tien-Yueh Liu has worked with notable companies in the technology sector, including MediaTek Corporation and Silicon Integrated Systems Corporation. His experience in these organizations has allowed him to develop and refine his expertise in integrated circuit design and innovation.

Collaborations

Some of Tien-Yueh Liu's coworkers include Ching-Chung Ko and Tao Cheng, who have collaborated with him on various projects in the field of integrated circuits.

Conclusion

Tien-Yueh Liu's contributions to integrated circuit technology have made a lasting impact on the industry. His innovative patents and collaborations with leading companies highlight his role as a key figure in advancing electronic device performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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