Company Filing History:

7 out of 4,763

Mediatek Corporation

patents

1 out of 293

Silicon Integrated Systems Corporation

patents

Years Active: 2004-2018

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8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10002833 - Power and ground routing of integrated circuit devices with improved IR drop and chip performance (2018-06-19),

2. 9698102 - Power and ground routing of integrated circuit devices with improved IR drop and chip performance (2017-07-04),

3. 9379059 - Power and ground routing of integrated circuit devices with improved IR drop and chip performance (2016-06-28),

4. 8661388 - Method of packing-based macro placement and semiconductor chip using the same (2014-02-25),

5. 8120067 - Power and ground routing of integrated circuit devices with improved IR drop and chip performance (2012-02-21),

6. 8072004 - Power and ground routing of integrated circuit devices with improved IR drop and chip performance (2011-12-06),

7. 7821038 - Power and ground routing of integrated circuit devices with improved IR drop and chip performance (2010-10-26),

8. 6708312 - Method for multi-threshold voltage CMOS process optimization (2004-03-16),

Title: Tien-Yueh Liu: Innovator in Integrated Circuit Technology

Introduction

Tien-Yueh Liu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit technology, holding a total of eight patents. His work focuses on improving the performance and efficiency of integrated circuits, which are essential components in modern electronic devices.

Latest Patents

One of Tien-Yueh Liu's latest patents is titled "Power and ground routing of integrated circuit devices with improved IR drop and chip performance." This invention describes an integrated circuit chip that includes a semiconductor substrate with multiple inter-metal dielectric (IMD) layers and first conductive layers made of copper. The design features a first insulating layer over the IMD layers and conductive layers, along with wiring lines in a second conductive layer made of aluminum for distributing power and ground signals. This innovative approach aims to enhance chip performance by addressing issues related to IR drop.

Career Highlights

Throughout his career, Tien-Yueh Liu has worked with notable companies in the technology sector, including MediaTek Corporation and Silicon Integrated Systems Corporation. His experience in these organizations has allowed him to develop and refine his expertise in integrated circuit design and innovation.

Collaborations

Some of Tien-Yueh Liu's coworkers include Ching-Chung Ko and Tao Cheng, who have collaborated with him on various projects in the field of integrated circuits.

Conclusion

Tien-Yueh Liu's contributions to integrated circuit technology have made a lasting impact on the industry. His innovative patents and collaborations with leading companies highlight his role as a key figure in advancing electronic device performance.

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