The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Sep. 15, 2010
Ching-chung Ko, Hsinchu County, TW;
Tao Cheng, Hsinchu, TW;
Tien-yueh Liu, Hsinchu, TW;
Dar-shii Chou, Taipei Hsien, TW;
Peng-cheng Kao, Hsinchu, TW;
Ching-Chung Ko, Hsinchu County, TW;
Tao Cheng, Hsinchu, TW;
Tien-Yueh Liu, Hsinchu, TW;
Dar-Shii Chou, Taipei Hsien, TW;
Peng-Cheng Kao, Hsinchu, TW;
Mediatek Inc., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
An integrated circuit chip includes a semiconductor substrate having thereon a plurality of inter-metal dielectric (IMD) layers and a plurality of first conductive layers embedded in respective the plurality of IMD layers, wherein the first conductive layers comprise copper; a first passivation layer overlying the plurality of IMD layers and the plurality of first conductive layers; a plurality of first power/ground mesh wiring lines, formed in a second conductive layer overlying the first passivation layer, for distributing power signal or ground signal, wherein the second conductive layer comprise aluminum; and a second passivation layer covering the second conductive layer and the first passivation layer.