The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2012
Filed:
Oct. 26, 2011
Ching-chung Ko, Hsinchu County, TW;
Tao Cheng, Hsinchu, TW;
Tien-yueh Liu, Hsinchu, TW;
Dar-shii Chou, New Taipei, TW;
Peng-cheng Kao, Hsinchu, TW;
Ching-Chung Ko, Hsinchu County, TW;
Tao Cheng, Hsinchu, TW;
Tien-Yueh Liu, Hsinchu, TW;
Dar-Shii Chou, New Taipei, TW;
Peng-Cheng Kao, Hsinchu, TW;
Mediatek Inc., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
An integrated circuit chip includes a semiconductor substrate having thereon a plurality of IMD layers and first conductive layers embedded in the IMD layers; a first insulating layer overlying the IMD layers and the first conductive layers; a plurality of first power/ground mesh wiring lines, in a second conductive layer overlying the first insulating layer, for distributing power signal or ground signal; and a second insulating layer covering the second conductive layer and the first insulating layer.