The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
May. 19, 2022
Mediatek Inc., Hsin-Chu, TW;
Wen-Sung Hsu, Hsin-Chu, TW;
Tao Cheng, Hsinchu, TW;
Nan-Cheng Chen, Hsin-Chu, TW;
Che-Ya Chou, Kaohsiung, TW;
Wen-Chou Wu, Hsinchu, TW;
Yen-Ju Lu, New Taipei, TW;
Chih-Ming Hung, McKinney, TX (US);
Wei-Hsiu Hsu, Hsinchu, TW;
MediaTek Inc., Hsin-Chu, TW;
Abstract
A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.