Mediatek Corporation

Yao-Pang Hsu

Chi-Yuan Chen

Chia-Hao Hsu

Tai-Yu Chen

Shiann-Tsong Tsai

Hsing-Chih Liu

Chung-Fa Lee

Ya-Jui Hsieh

Shih-Chao Chiu

Wen-Chun Huang

Wen-Sung Hsu

Yi-Lin Tsai

Sang-Mao Chiu

An antenna-in-module package-on-package includes an antenna package having a top surface and a bottom surface opposing the top surface. The antenna package includes a radiative antenna element on the bottom surface. A chip package is mounted on the top surface of the antenna package. The chip package includes a semiconductor chip. Conductive elements are disposed between the antenna package and the chip package to electrically interconnect the chip package and the antenna package. A radiative antenna element is disposed on the bottom surface of the antenna package. At least one air trench is disposed on the bottom surface of the antenna package.

Antenna-in-module package-on-package with air trenches

A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

Lidded semiconductor package

A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.

Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure

A semiconductor package including a base comprising an upper surface and a lower surface that is opposite to the upper surface; a radio-frequency (RF) module embedded near the upper surface of the base; an integrated circuit (IC) die mounted on the lower surface of the base in a flip-chip manner so that a backside of the IC die is available for heat dissipation; a plurality of conductive structures disposed on the lower surface of the base and arranged around the IC die; and a metal thermal interface layer comprising a backside metal layer that is in contact with the backside of the IC die, and a solder paste conformally printed on the backside metal layer.

A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a semiconductor die, a molding material, a first bonding layer, and a thermal interface material. The semiconductor die is disposed over the substrate. The molding material surrounds the semiconductor die. The first bonding layer is disposed over the semiconductor die. The thermal interface material is disposed over the molding material.

Semiconductor package structure

A semiconductor package includes a base having an upper surface and a lower surface opposite to the upper surface. An antenna array structure is embedded at the upper surface of the base. An IC die is mounted on the lower surface of the base in a flip-chip manner so that a backside of the IC die is available for heat dissipation. Solder ball pads are disposed on the lower surface of the base and arranged around the IC die. The semiconductor package further includes a metal thermal interface layer having a backside metal layer that is in direct contact with the backside of the IC die, and a solder paste conformally printed on the backside metal layer.

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Hsinchu, Taiwan

Yao-Pang Hsu