The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2023
Filed:
May. 22, 2020
Applicant:
Mediatek Inc., Hsinchu, TW;
Inventors:
Ya-Jui Hsieh, Hsinchu, TW;
Chia-Hao Hsu, Hsinchu, TW;
Tai-Yu Chen, Hsinchu, TW;
Yao-Pang Hsu, Hsinchu, TW;
Assignee:
MediaTek Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); H01L 23/3672 (2013.01);
Abstract
A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a semiconductor die, a molding material, a first bonding layer, and a thermal interface material. The semiconductor die is disposed over the substrate. The molding material surrounds the semiconductor die. The first bonding layer is disposed over the semiconductor die. The thermal interface material is disposed over the molding material.