logo

For the Inventor, By the Inventor

Hsinchu, Taiwan

Chia-Hao Hsu

This inventor holds 78 USPTO granted patents and 18 published patent applications and 5 EPO patents, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Mediatek Corporation, Compal Electronics, Inc.. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Hao Hsu. Retrieved from https://idiyas.com/inventor/chia-hao-hsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 78 

% Patents Active = 71.8

 

Average Co-Inventor Count = 3.7

ph-index = 8

Forward Citations = 428(Granted Patents)

Forward Citations (Not Self Cited) = 382(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Kaohsiung, TW (2013)
  • Changhua County, TW (2013 - 2018)
  • Lukang, TW (2017 - 2018)
  • Hsinchu County, TW (2019)
  • Keelung, TW (2020 - 2022)
  • Hsinchu, TW (2012 - 2024)
  • Taipei, TW (2015 - 2024)

Company Filing History:

goldMedal41 out of 42,965 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal13 out of 5,127 
 
Mediatek Corporation
 patents
bronzeMedal6 out of 1,007 
 
Compal Electronics, Inc.
 patents
4. 6 out of 1,371 
 
Lite-On Technology Corporation
 patents
5. 3 out of 15,144 
 
Dell Products Inc.
 patents
6. 2 out of 360 
 
Sunplus Technology Co., Ltd.
 patents
7. 1 out of 106 
 
Chang Chun Petrochemical Co., Ltd.
 patents
8. 1 out of 516 
 
Lite-On Electronics (Guangzhou) Limited
 patents
9. 1 out of 585 
 
Qisda Corporation
 patents
10. 1 out of 13 
 
Tpk Glass Solutions (Xiamen) Inc.
 patents
11. 4 out of 834,601 
Other
 patents
where one patent can have more than one assignee

Years Active: 2012-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Semiconductor Package
Thermal Management
Integrated Circuit
Liquid-Cooling Lid
Interconnect Die
Heat Dissipation
Device Dies
Manufacturing Method
Electronic Device
Hinge Structure
Polyvinyl Alcohol
Touch Panel
78 patents (USPTO):Explore Patents
1. 12707969 - Manufacturing method of semiconductor package including cutting heat dissipation sheet into a plurality of heat dissipation films (2026-08-11),
2. 12334464 - Encapsulated package including device dies connected via interconnect die (2025-06-17),
3. 12327781 - Semiconductor structure and manufacturing method thereof (2025-06-10),
4. 12315786 - Semiconductor structure and manufacturing method thereof (2025-05-27),
5. 12300573 - Semiconductor device and manufacturing method thereof (2025-05-13),
6. 12261151 - Integrated circuit packages (2025-03-25),
7. 12087664 - Semiconductor package having liquid-cooling lid (2024-09-10),
8. 12062590 - Method for manufacturing semiconductor package structure (2024-08-13),
9. 11978714 - Encapsulated package including device dies connected via interconnect die (2024-05-07),
10. 11967570 - Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure (2024-04-23),
11. 11908767 - Semiconductor package structure (2024-02-20),
12. 11907027 - Gear synchronized dual axis pivot hinge (2024-02-20),
13. 11728314 - Methods of forming integrated circuit packages (2023-08-15),
14. 11728238 - Semiconductor package with heat dissipation films and manufacturing method thereof (2023-08-15),
15. 11705413 - Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure (2023-07-18),

Title: Chia-Hao Hsu: A Pioneer in Semiconductor Innovations

Introduction

Chia-Hao Hsu, a prolific inventor based in Hsinchu, Taiwan, holds an impressive portfolio of 72 patents. His contributions to the field of semiconductor technology have set new standards for advancements in manufacturing processes and cooling systems.

Latest Patents

Among his latest innovations are two significant patents. The first, titled "Semiconductor package having liquid-cooling lid," describes a semiconductor package that features a substrate with a die mounted in a flip-chip configuration. This innovative package includes a lid designed with a liquid-cooling channel, enabling efficient heat management for the semiconductor. The second patent, "Method for manufacturing semiconductor package structure," introduces a structured approach integrating multiple thermal interface materials (TIM) to optimize the heat output of semiconductor dies, ensuring better thermal efficiency during operation.

Career Highlights

Chia-Hao Hsu's career includes notable positions at leading companies such as Taiwan Semiconductor Manufacturing Company Ltd. and MediaTek Corporation. His work at these organizations has significantly influenced semiconductor manufacturing technologies, bolstering their performances and capabilities in the industry.

Collaborations

Hsu has collaborated with various talented professionals throughout his career, including colleagues Chia-Chen Chen and Chia-Ching Huang. These partnerships have enabled the sharing of innovative ideas and technical expertise, leading to groundbreaking advancements in semiconductor packaging.

Conclusion

Chia-Hao Hsu's dedication to innovation in the semiconductor field, alongside his numerous patents, highlights his substantial impact on the industry. His work continues to inspire future developments that promise to enhance the performance and efficiency of electronic devices worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…