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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12334464 B1

PDFFull Text
Date of Patent:
Jun. 17, 2025

Filed:

Apr. 08, 2024

Encapsulated package including device dies connected via interconnect die

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Kuo-Chiang Ting, Hsinchu, TW;

Chi-Hsi Wu, Hsinchu, TW;

Shang-Yun Hou, Jubei, TW;

Tu-Hao Yu, Hsinchu, TW;

Chia-Hao Hsu, Hsinchu, TW;

Ting-Yu Yeh, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

John P Dulka

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 24/24 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/08 (2013.01); H01L 24/19 (2013.01); H01L 24/25 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 21/563 (2013.01); H01L 23/3128 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08235 (2013.01); H01L 2224/08265 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/83001 (2013.01);
Abstract

A method includes bonding a first device die and a second device die to an interconnect die. The interconnect die includes a first portion over and bonded to the first device die, and a second portion over and bonded to the second device die. The interconnect die electrically connects the first device die to the second device die. The method further includes encapsulating the interconnect die in an encapsulating material, and forming a plurality of redistribution lines over the interconnect die.

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