Hsinchu, Taiwan

Chi-Hsi Wu

USPTO Granted Patents = 178 

Average Co-Inventor Count = 5.1

ph-index = 16

Forward Citations = 3,243(Granted Patents)

DiyaCoin DiyaCoin 4.61 


Inventors with similar research interests:


Location History:

  • Taichung, TW (1998 - 2000)
  • Hsinchi, TW (2017)
  • Taoyuan, TW (2018)
  • Hsinchu, TW (1999 - 2024)

Company Filing History:


Years Active: 1998-2025

where 'Filed Patents' based on already Granted Patents

178 patents (USPTO):

Title: Chi-Hsi Wu: Innovating the Semiconductor Industry

Introduction:

In the fast-paced world of semiconductor technology, inventors like Chi-Hsi Wu make significant contributions to advancements in this field. With a location in Hsinchu, Taiwan, Chi-Hsi Wu has built an impressive portfolio of inventions, holding an astounding 155 patents. This article highlights some of his latest patents, career highlights, and notable collaborations.

Latest Patents:

One of Chi-Hsi Wu's recent patents is titled "Semiconductor Device and Method." This invention involves a semiconductor device that includes a substrate, a redistribution layer, and an encapsulant. The device also features connectors attached to the substrate and a polymer layer that enhances its overall performance.

Another notable patent from Chi-Hsi Wu is "Giga Interposer Integration Through Chip-on-Wafer-on-Substrate." This invention involves a semiconductor structure that includes multiple interposers and dies attached to each interposer. This unique integration technique expands the potential for improved performance and efficiency in semiconductor devices.

Career Highlights:

Chi-Hsi Wu has made remarkable contributions throughout his career, working with renowned semiconductor companies. One such company is Taiwan Semiconductor Manufacturing Co. Ltd., known as TSMC. As one of the leading semiconductor foundries globally, TSMC relies on the expertise of inventors like Chi-Hsi Wu to drive innovations in the industry.

Additionally, Chi-Hsi Wu has also played a role in shaping the advancements at Winbond Electronics Corporation. With a focus on memory solutions and CMOS technologies, Winbond Electronics Corporation benefits greatly from Chi-Hsi Wu's technical expertise and patentable innovations.

Collaborations:

In the world of innovation, collaboration is often key to success. Chi-Hsi Wu has had the opportunity to collaborate with fellow inventors to bring novel ideas to fruition. Among his notable coworkers are Chen-Hua Yu and Der-Chyang Yeh. These collaborations have undoubtedly intensified the collective knowledge and expertise within the semiconductor industry.

Conclusion:

Chi-Hsi Wu's contributions to the semiconductor industry are evident through his extensive patent portfolio and collaborations with prominent companies and inventors. His latest patents, such as the "Semiconductor Device and Method" and "Giga Interposer Integration Through Chip-on-Wafer-on-Substrate," showcase his commitment to advancing technology and driving innovations in the field. Chi-Hsi Wu's work serves as an inspiration to the next generation of inventors and reinforces the importance of patents in accelerating technological progress.

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