logo

For the Inventor, By the Inventor

Hsinchu, Taiwan

Kuo-Chiang Ting

This inventor holds 70 USPTO granted patents and 64 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2004-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuo-Chiang Ting. Retrieved from https://idiyas.com/inventor/kuo-chiang-ting

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 70 

% Patents Active = 97.1

Average Co-Inventor Count = 4.8

ph-index = 9

Forward Citations = 788(Granted Patents)

Forward Citations (Not Self Cited) = 716(Dec 10, 2025)


Location History:

  • Yunlin, TW (2004 - 2006)
  • Hsinchu, TW (2014 - 2024)

Company Filing History:

goldMedal65 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal5 out of 465 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2004-2026

Loading Chart...
Areas of Expertise:
Chip Structure
Semiconductor Device
Photonic Package
Integrated Circuit
Heat Dissipation
3DIC
Optical Transceiver
Chiplet Interposer
SRAM Cell Design
Redistribution Layers
Interconnect Die
Manufacturing Method
70 patents (USPTO):Explore Patents
1. 12721176 - Semiconductor device and methods of manufacture (2026-08-25),
2. 12708045 - Method and structure for a three-dimensional package (2026-08-11),
3. 12708039 - Method of manufacturing 3DIC package comprising a plurality of discrete device dies bonding to a wafer (2026-08-11),
4. 12707977 - Integrated circuit packages and methods of forming the same (2026-08-11),
5. 12707969 - Manufacturing method of semiconductor package including cutting heat dissipation sheet into a plurality of heat dissipation films (2026-08-11),
6. 12690492 - Integrated circuit package with improved heat dissipation efficiency and methods of forming the same (2026-07-21),
7. 12622290 - Chip structure and method of fabricating the same (2026-05-05),
8. 12564082 - Semiconductor device (2026-02-24),
9. 12564057 - Chiplet interposer (2026-02-24),
10. 12482753 - Semiconductor device having redistribution layers formed on an active wafer and methods of making the same (2025-11-25),
11. 12442978 - Photonic package and method of manufacture (2025-10-14),
12. 12400878 - Integrated circuit package and method (2025-08-26),
13. 12392961 - Structure and process for photonic packages (2025-08-19),
14. 12362291 - Semiconductor device and method (2025-07-15),
15. 12334464 - Encapsulated package including device dies connected via interconnect die (2025-06-17),

Title: Inventor Kuo-Chiang Ting

Introduction: Kuo-Chiang Ting is a renowned inventor based in Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kuo-Chiang Ting holds several patents in various technological areas, including semiconductor devices, communication systems, and renewable energy solutions.

Career Highlights: With a career spanning over two decades, Ting has worked with leading tech companies and research institutions, developing cutting-edge technologies that have revolutionized the industry.

Collaborations: Throughout his career, Kuo-Chiang Ting has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: Kuo-Chiang Ting's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…